 |
SMD50324 |
4 PAD SEAM |
8 MHz ~ 48.0 MHz |
5.0×3.2×0.8 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
DT38 |
插件 |
32.768KHz |
Φ3.0×8.0 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
X8(HC-43U) |
DIP-2p |
4~100MHz ±3,±5,±10ppm |
10 x 3.0 |
 |
Gold electrode, vacuum Fast warm up High stability, low temperature frequency coefficient |
 |
 |
X5(HC-45U) |
DIP-2p |
19.2~120MHz ±3,±5,±10ppm |
8.5 x 3.1 |
 |
Gold electrode, vacuum Fast warm up High stability, low temperature frequency coefficient |
 |
 |
XH (um-5) |
DIP-2p |
8~80MHz ±3,±5,±10ppm |
7.3 x 2.6 |
 |
Gold electrode, vacuum Fast warm up High stability, low temperature frequency coefficient |
 |
 |
FC135 |
2 PAD SEAM |
32.768KHz |
3.2×1.5×0.8 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
DT26 |
插件 |
32.768KHz |
Φ2.0×6.0 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
49U |
插件 |
1 MHz ~ 48.0 MHz |
4.9mm |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
49S |
插件 |
3 MHz ~ 48.0 MHz |
4.9mm |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
SMD70504 |
4 PAD SEAM |
6.0 MHz ~ 80.0 MHz |
7.0×5.0×1.1 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
SMD60354 |
4 PAD SEAM |
7.3 MHz ~ 50.0 MHz |
6.0×3.5×1.0 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |
 |
SMD32254 |
4 PAD SEAM |
12.0 MHz ~ 50.0 MHz |
3.2×2.5×0.8 |
 |
Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
 |