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OSMD5032 |
4 PAD SEAM |
3.0 MHz ~ 300.0 MHz |
5.0×3.2×1.5 |
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Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
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UM-1/UM-5 |
2 poles |
21.4, 21.7, 38.850, 45 10.7 ~ 70.0MHz |
8.0×2.4×8.0/5.8 |
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Standard package Available with formed leads and mounting clip |
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JDR433A |
TO39 |
433.92MHz |
9.15*5.08*6.3 |
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JDR433A(433.92)TO39 |
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DIP08-Half Size (3.3V/5V) |
DIP 4 Pin |
0.5 ~ 268MHz |
12.5*12.7*5.5mm |
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-40~+85℃ HCMOS/TTL |
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DIP14-Full Size (3.3V/5V) |
DIP 4 Pin |
0.5 ~ 268MHz |
20.7*12.7*5.3mm |
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-40~+85℃ HCMOS/TTL |
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NI-10M-3000 Series |
CMOS |
10MHz |
36.3 x 27.2 |
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SC-CUT Crystal Double Oven Design High Stability Holdover < 10uS for 24 hrs Input Power = 3.3v |
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ZTT |
DIP-3p |
3.579MHz---60MHz |
5*10*13 |
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+/-0.3%---0.5% |
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R154M |
F11 |
154MHZ |
11* 8.5* 4.5 |
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产品型号 谐振频率 频率精度 插入损耗 封装 R154M 154 ±50;±75;±100 1.2 F11 |
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SMD50324 |
4 PAD SEAM |
8 MHz ~ 48.0 MHz |
5.0×3.2×0.8 |
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Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
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UM-1/UM-5×2 |
4 poles |
21.4, 21.7, 38.850, 45 10.7~70.0MHz |
8.0×2.4×8.0/5.8 |
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Standard package Available with formed leads and mounting clip |
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DT38 |
插件 |
32.768KHz |
Φ3.0×8.0 |
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Excellent Reliability Performance Reflow soldering temperature: 260℃ max |
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R315M |
S4 SMD-6p |
315MHZ |
3.8*3.8*1.5 |
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R315M 315 ±50;±75;±100 1.2 S4 |
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